ACCESS TIME-MAX:  300 NS

I/O TYPE:  COMMON

JESD-30 CODE:  R-GDIP-T24

JESD-609 CODE:  E0

LENGTH:  32.0675 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM2716B-300DC

MEMORY DENSITY:  16.384 KBIT

MEMORY IC TYPE:  UVPROM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  24

NUMBER OF WORDS:  2.048 K

NUMBER OF WORDS CODE:  2000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  2KX8

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  WDIP

PACKAGE DESCRIPTION:  WDIP, DIP24,.6

PACKAGE EQUIVALENCE CODE:  DIP24,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE, WINDOW

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  DIP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  24

POWER SUPPLIES:  5 V

PROGRAMMING VOLTAGE:  12.5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.588 MM

SUBCATEGORY:  OTP ROMS

SUPPLY CURRENT-MAX:  100 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  NMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  15.24 MM