ACCESS TIME-MAX:  300 NS

I/O TYPE:  COMMON

JESD-30 CODE:  R-GDIP-T28

JESD-609 CODE:  E0

LENGTH:  37.1475 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM27512-30/BXA

MEMORY DENSITY:  524.288 KBIT

MEMORY IC TYPE:  UVPROM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  28

NUMBER OF WORDS:  65.536 K

NUMBER OF WORDS CODE:  64000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

ORGANIZATION:  64KX8

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  WDIP

PACKAGE DESCRIPTION:  WDIP, DIP28,.6

PACKAGE EQUIVALENCE CODE:  DIP28,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE, WINDOW

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  DIP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  28

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SCREENING LEVEL:  38535Q/M;38534H;883B

SEATED HEIGHT-MAX:  5.588 MM

SUBCATEGORY:  EPROMS

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  NMOS

TEMPERATURE GRADE:  MILITARY

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  15.24 MM