ACCESS TIME-MAX:  40 NS

JESD-30 CODE:  R-GDFP-F16

JESD-609 CODE:  E0

LENGTH:  10.16 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM27S13A/BFA

MEMORY DENSITY:  2.048 KBIT

MEMORY IC TYPE:  OTP ROM

MEMORY WIDTH:  4

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  16

NUMBER OF WORDS:  512 WORDS

NUMBER OF WORDS CODE:  512

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

ORGANIZATION:  512X4

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  DFP

PACKAGE DESCRIPTION:  DFP, FL16,.3

PACKAGE EQUIVALENCE CODE:  FL16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  DFP

PIN COUNT:  16

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SCREENING LEVEL:  38535Q/M;38534H;883B

SEATED HEIGHT-MAX:  2.159 MM

SUBCATEGORY:  OTP ROMS

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  BIPOLAR

TEMPERATURE GRADE:  MILITARY

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  FLAT

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

WIDTH:  6.731 MM