ACCESS TIME-MAX:  120 NS

ADDITIONAL FEATURE:  CONFG AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK

JESD-30 CODE:  R-PBGA-B48

LENGTH:  8 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM29LV400BB-120WAI

MEMORY DENSITY:  4.1943 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  48

NUMBER OF WORDS:  524.288 K

NUMBER OF WORDS CODE:  512000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  512KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  6 X 8 MM, 0.80 MM PITCH, FBGA-48

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PIN COUNT:  48

PROGRAMMING VOLTAGE:  3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

WIDTH:  6 MM