ACCESS TIME-MAX:  300 NS

I/O TYPE:  COMMON

JESD-30 CODE:  R-XDIP-T18

JESD-609 CODE:  E0

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM9050CDC

MEMORY DENSITY:  4.096 KBIT

MEMORY WIDTH:  1

NUMBER OF TERMINALS:  18

NUMBER OF WORDS:  4.096 K

NUMBER OF WORDS CODE:  4000

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  4KX1

OUTPUT CHARACTERISTICS:  OPEN-DRAIN

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP18,.3

PACKAGE EQUIVALENCE CODE:  DIP18,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  64

SUBCATEGORY:  OTHER MEMORY ICS

SURFACE MOUNT:  NO

TECHNOLOGY:  MOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL