ADDRESS BUS WIDTH:  26

BIT SIZE:  32

CLOCK FREQUENCY-MAX:  32 KHZ

DAC CHANNELS:  NO

DMA CHANNELS:  YES

EXTERNAL DATA BUS WIDTH:  32

HAS ADC:  NO

JESD-30 CODE:  S-PBGA-B292

JESD-609 CODE:  E0

LENGTH:  27 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  ELANSC400-100AC

NUMBER OF I/O LINES:  32

NUMBER OF TERMINALS:  292

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PWM CHANNELS:  NO

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA292,20X20,50

PACKAGE EQUIVALENCE CODE:  BGA292,20X20,50

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  292

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

ROM PROGRAMMABILITY:  FLASH

SEATED HEIGHT-MAX:  2.61 MM

SPEED:  100 MHZ

SUBCATEGORY:  MICROPROCESSORS

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  2.7 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  27 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER