S3057TB

Factory Authorized Line

APPLIED MICRO CIRCUITS

Electronic Component

S3057TB

LBGA
Call for availability APPLIED MICRO CIRCUITS
Mfr Part # S3057TB
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  LBGAPACKAGE DESCRIPTION:  LBGA,PACKAGE SHAPE:  SQUAREPACKAGE STYLE:  GRID ARRAY, LOW PROFILEPART PACKAGE CODE:  BGA
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

APPLICATIONS:  ATM;SDH;SONET

JESD-30 CODE:  S-PBGA-B156

JESD-609 CODE:  E0

LENGTH:  21 MM

MANUFACTURER:  APPLIED MICRO CIRCUITS CORPORATION

MANUFACTURER PART NUMBER:  S3057TB

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  156

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -20 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  156

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.65 MM

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  BICMOS

TELECOM IC TYPE:  TRANSCEIVER

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  21 MM