ATTACHMENT METHOD:  SMD PAD

CATEGORY:  FANS, THERMAL MANAGEMENT

FAMILY:  THERMAL - HEAT SINKS

HEIGHT OFF BASE (HEIGHT OF FIN):  0.390" (9.91MM)

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

LENGTH:  0.320" (8.13MM)

MANUFACTURER:  ASSMANN WSW COMPONENTS

MANUFACTURER PART NUMBER:  V-1100-SMD/B-L

MANUFACTURER STANDARD LEAD TIME:  20 WEEKS

MATERIAL:  COPPER

MATERIAL FINISH:  TIN

MOISTURE SENSITIVITY LEVEL (MSL):  1 (UNLIMITED)

PACKAGE COOLED:  D²PAK, TO-252

SHAPE:  RECTANGULAR

STANDARD PACKAGE:  500

THERMAL RESISTANCE @ NATURAL:  25°C/W

TYPE:  TOP MOUNT

WIDTH:  0.790" (20.07MM)