ADDITIONAL FEATURE:  ORGANIZED AS 512 PAGES OF 264 BYTES EACH

CLOCK FREQUENCY-MAX (FCLK):  20 MHZ

JESD-30 CODE:  S-PBGA-B9

JESD-609 CODE:  E0

LENGTH:  5 MM

MANUFACTURER:  ATMEL CORPORATION

MANUFACTURER PART NUMBER:  AT45DB011B-CI

MEMORY DENSITY:  1.0486 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  9

NUMBER OF WORDS:  1.0486 M

NUMBER OF WORDS CODE:  1000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  1MX1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TBGA

PACKAGE DESCRIPTION:  TBGA, BGA9,3X3,40

PACKAGE EQUIVALENCE CODE:  BGA9,3X3,40

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  9

POWER SUPPLIES:  3/3.3 V

PROGRAMMING VOLTAGE:  2.7 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SERIAL BUS TYPE:  SPI

STANDBY CURRENT-MAX:  10 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  25 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

TYPE:  NOR TYPE

WIDTH:  5 MM

WRITE PROTECTION:  HARDWARE