ADDITIONAL FEATURE:  HALF DUPLEX; FULL DUPLEX

DATA RATE:  200 MBPS

JESD-30 CODE:  R-PDSO-G24

JESD-609 CODE:  E3

LENGTH:  7.8 MM

MANUFACTURER:  CML MICROCIRCUITS PLC

MANUFACTURER PART NUMBER:  CMX589AE2

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  24

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP24,.25

PACKAGE EQUIVALENCE CODE:  TSSOP24,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  24

POWER SUPPLIES:  3.3/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUBCATEGORY:  MODEMS

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TELECOM IC TYPE:  MODEM

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  4.4 MM