CONSTRUCTION:  CHIP

ELEMENT POWER DISSIPATION:  63 MW

FIRST ELEMENT RESISTANCE:  100 O

JESD-609 CODE:  E0

MANUFACTURER:  CTS CORPORATION

MANUFACTURER PART NUMBER:  745X101101J

MANUFACTURER SERIES:  745

MOUNTING FEATURE:  SURFACE MOUNT

NETWORK TYPE:  BUSSED

NUMBER OF ELEMENTS:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  10

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE DESCRIPTION:  SMT, 1225

PACKAGE HEIGHT:  600 ΜM

PACKAGE LENGTH:  6.4 MM

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKAGE STYLE:  SMT

PACKAGE WIDTH:  3.2 MM

PACKING METHOD:  TR, PAPER, 7 INCH

RATED POWER DISSIPATION (P):  504 MW

RATED TEMPERATURE:  70 °C

RESISTANCE:  100 O

RESISTOR TYPE:  ARRAY/NETWORK RESISTOR

SERIES:  745X101(GJ TOL)

SIZE CODE:  1225

SUBCATEGORY:  ARRAY/NETWORK RESISTORS

SURFACE MOUNT:  YES

TECHNOLOGY:  METAL GLAZE/THICK FILM

TEMPERATURE COEFFICIENT:  200 PPM/°C

TERMINAL FINISH:  TIN LEAD

TERMINAL SHAPE:  WRAPAROUND

TOLERANCE:  5 %

WORKING VOLTAGE:  50 V