IMP813LEPA

IMP813LEPA

DIP, DIP8,.3

Call for availability

Manufactured by:

DAILY SILVER IMP

Mfr Part#:  IMP813LEPA

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP8,.3

PACKAGE EQUIVALENCE CODE:  DIP8,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-PDIP-T8

MANUFACTURER:  DAILY SILVER IMP MICROELECTRONICS CO LTD

MANUFACTURER PART NUMBER:  IMP813LEPA

NUMBER OF TERMINALS:  8

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP8,.3

PACKAGE EQUIVALENCE CODE:  DIP8,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  POWER MANAGEMENT CIRCUITS

SUPPLY CURRENT-MAX (ISUP):  140 ΜA

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

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