EM68C16CWQG-25H

EM68C16CWQG-25H

FBGA-84

Call for availability

Manufactured by:

ETRON

Mfr Part#:  EM68C16CWQG-25H

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  FBGA-84

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS MODE:  FOUR BANK PAGE BURST

ACCESS TIME-MAX:  400 PS

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

JESD-30 CODE:  R-PBGA-B84

LENGTH:  12.5 MM

MANUFACTURER:  ETRON TECHNOLOGY INC

MANUFACTURER PART NUMBER:  EM68C16CWQG-25H

MEMORY DENSITY:  1.0737 GBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  84

NUMBER OF WORDS:  67.1089 M

NUMBER OF WORDS CODE:  64000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  64MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  FBGA-84

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  1.9 V

SUPPLY VOLTAGE-MIN (VSUP):  1.7 V

SUPPLY VOLTAGE-NOM (VSUP):  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  8 MM

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