ADDRESS BUS WIDTH:  0

BOUNDARY SCAN:  YES

BUS COMPATIBILITY:  PCI

COMMUNICATION PROTOCOL:  ASYNC, BIT

DATA ENCODING/DECODING METHOD:  NRZ

DATA TRANSFER RATE-MAX:  3.125 MBPS

EXTERNAL DATA BUS WIDTH:  8

JESD-30 CODE:  S-PBGA-B176

JESD-609 CODE:  E1

LENGTH:  13 MM

LOW POWER MODE:  YES

MANUFACTURER:  EXAR CORPORATION

MANUFACTURER PART NUMBER:  XR17V358IB176-F

MOISTURE SENSITIVITY LEVEL:  4

NUMBER OF SERIAL I/OS:  8

NUMBER OF TERMINALS:  176

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA, BGA176,15X15,32

PACKAGE EQUIVALENCE CODE:  BGA176,15X15,32

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  245

PIN COUNT:  176

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.5 MM

SUBCATEGORY:  SERIAL IO/COMMUNICATION CONTROLLERS

SUPPLY VOLTAGE-NOM:  1.2 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/SILVER/COPPER (SN/AG/CU)

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  13 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SERIAL IO/COMMUNICATION CONTROLLER, SERIAL