ADDITIONAL FEATURE:  ALSO INCLUDED 256K X 16 SRAM

JESD-30 CODE:  R-PBGA-B73

JESD-609 CODE:  E0

LENGTH:  11.6 MM

MANUFACTURER:  FUJITSU SEMICONDUCTOR LIMITED

MANUFACTURER PART NUMBER:  MB84VD22183EB-90-PBS

MEMORY DENSITY:  33.5544 MBIT

MEMORY IC TYPE:  MEMORY CIRCUIT

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  73

NUMBER OF WORDS:  2.0972 M

NUMBER OF WORDS CODE:  2000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -25 °C

ORGANIZATION:  2MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  73

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.4 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.3 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  8 MM