GS8321Z36AGD-200I

GS8321Z36AGD-200I

LBGA

Call for availability

Manufactured by:

GSI TECH

Mfr Part#:  GS8321Z36AGD-200I

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE

JESD-30 CODE:  R-PBGA-B165

JESD-609 CODE:  E1

LENGTH:  15 MM

MANUFACTURER:  GSI TECHNOLOGY

MANUFACTURER PART NUMBER:  GS8321Z36AGD-200I

MEMORY DENSITY:  37.7487 MBIT

MEMORY IC TYPE:  ZBT SRAM

MEMORY WIDTH:  36

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  165

NUMBER OF WORDS:  1.0486 M

NUMBER OF WORDS CODE:  1000000

OPERATING MODE:  SYNCHRONOUS

ORGANIZATION:  1MX36

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  165

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.4 MM

SUPPLY VOLTAGE-MAX (VSUP):  2.7 V

SUPPLY VOLTAGE-MIN (VSUP):  2.3 V

SUPPLY VOLTAGE-NOM (VSUP):  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TERMINAL FINISH:  TIN/SILVER/COPPER (SN/AG/CU)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  13 MM

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