ACCESS TIME-MAX:  8 NS

ADDITIONAL FEATURE:  FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

JESD-30 CODE:  R-PBGA-B165

LENGTH:  17 MM

MANUFACTURER:  GSI TECHNOLOGY

MANUFACTURER PART NUMBER:  GS8322Z36E-166I

MEMORY DENSITY:  37.7487 MBIT

MEMORY IC TYPE:  ZBT SRAM

MEMORY WIDTH:  36

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  165

NUMBER OF WORDS:  1.0486 M

NUMBER OF WORDS CODE:  1000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  1MX36

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  165

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.4 MM

SUPPLY VOLTAGE-MAX (VSUP):  2.7 V

SUPPLY VOLTAGE-MIN (VSUP):  2.3 V

SUPPLY VOLTAGE-NOM (VSUP):  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  15 MM