CLOCK FREQUENCY-MAX (FCLK):  100 KHZ

DATA RETENTION TIME-MIN:  100

ENDURANCE:  100000 WRITE/ERASE CYCLES

I2C CONTROL BYTE:  1010DMMR

JESD-30 CODE:  R-PDSO-G8

JESD-609 CODE:  E0

LENGTH:  4.89 MM

MANUFACTURER:  IC MICROSYSTEMS SDN BHD

MANUFACTURER PART NUMBER:  X24C08S8

MEMORY DENSITY:  8.192 KBIT

MEMORY IC TYPE:  EEPROM

MEMORY WIDTH:  8

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  1.024 K

NUMBER OF WORDS CODE:  1000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  1KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP8,.25

PACKAGE EQUIVALENCE CODE:  SOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  SOIC

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  8

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.75 MM

SERIAL BUS TYPE:  I2C

STANDBY CURRENT-MAX:  150 ΜA

SUBCATEGORY:  EEPROMS

SUPPLY CURRENT-MAX:  3 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  3.9 MM

WRITE CYCLE TIME-MAX (TWC):  10 MS