IDT70V3379S4BF

Factory Authorized Line

INTEGRATED DEVICE TECHNOLOGY

Electronic Component

IDT70V3379S4BF

TFBGA, BGA208,17X17,32
Call for availability INTEGRATED DEVICE TECHNOLOGY
Mfr Part # IDT70V3379S4BF
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  TFBGAPACKAGE DESCRIPTION:  TFBGA, BGA208,17X17,32PACKAGE EQUIVALENCE CODE:  BGA208,17X17,32PACKAGE SHAPE:  SQUAREPACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCHPART PACKAGE CODE:  BGA
Contact Sales

Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ACCESS TIME-MAX:  4.2 NS

ADDITIONAL FEATURE:  PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE

CLOCK FREQUENCY-MAX (FCLK):  133 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  S-PBGA-B208

JESD-609 CODE:  E0

LENGTH:  15 MM

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT70V3379S4BF

MEMORY DENSITY:  589.824 KBIT

MEMORY IC TYPE:  DUAL-PORT SRAM

MEMORY WIDTH:  18

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  2

NUMBER OF TERMINALS:  208

NUMBER OF WORDS:  32.768 K

NUMBER OF WORDS CODE:  32000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  32KX18

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA, BGA208,17X17,32

PACKAGE EQUIVALENCE CODE:  BGA208,17X17,32

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  225

PIN COUNT:  208

POWER SUPPLIES:  2.5/3.3,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

STANDBY CURRENT-MAX:  15 MA

STANDBY VOLTAGE-MIN:  3.15 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  460 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.45 V

SUPPLY VOLTAGE-MIN (VSUP):  3.15 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN63PB37)

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  15 MM