ACCESS TIME-MAX:  5 NS

CLOCK FREQUENCY-MAX (FCLK):  100 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  S-PBGA-B256

JESD-609 CODE:  E0

LENGTH:  17 MM

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT70V3389S5BC

MEMORY DENSITY:  1.1796 MBIT

MEMORY IC TYPE:  DUAL-PORT SRAM

MEMORY WIDTH:  18

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  2

NUMBER OF TERMINALS:  256

NUMBER OF WORDS:  65.536 K

NUMBER OF WORDS CODE:  64000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  64KX18

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA, BGA256,16X16,40

PACKAGE EQUIVALENCE CODE:  BGA256,16X16,40

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  225

PIN COUNT:  256

POWER SUPPLIES:  2.5/3.3,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.5 MM

STANDBY CURRENT-MAX:  15 MA

STANDBY VOLTAGE-MIN:  3.15 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  360 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.45 V

SUPPLY VOLTAGE-MIN (VSUP):  3.15 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN63PB37)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  17 MM