IDT74FST163233PA

Factory Authorized Line

INTEGRATED DEVICE TECHNOLOGY

Electronic Component

IDT74FST163233PA

TSSOP, TSSOP56,.3,20
Call for availability INTEGRATED DEVICE TECHNOLOGY
Mfr Part # IDT74FST163233PA
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  TSSOPPACKAGE DESCRIPTION:  TSSOP, TSSOP56,.3,20PACKAGE EQUIVALENCE CODE:  TSSOP56,.3,20PACKAGE SHAPE:  RECTANGULARPACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCHPART PACKAGE CODE:  TSSOP
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ADDITIONAL FEATURE:  BUS SWITCH

FAMILY:  CBT/FST/QS/5C/B

JESD-30 CODE:  R-PDSO-G56

JESD-609 CODE:  E0

LENGTH:  14 MM

LOAD CAPACITANCE (CL):  50 PF

LOGIC IC TYPE:  BUS EXCHANGER

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT74FST163233PA

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF BITS:  8

NUMBER OF FUNCTIONS:  2

NUMBER OF PORTS:  3

NUMBER OF TERMINALS:  56

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

OUTPUT CHARACTERISTICS:  3-STATE

OUTPUT POLARITY:  TRUE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP56,.3,20

PACKAGE EQUIVALENCE CODE:  TSSOP56,.3,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  56

POWER SUPPLIES:  5 V

PROPAGATION DELAY (TPD):  250 PS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUBCATEGORY:  OTHER LOGIC ICS

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN85PB15)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  6.1 MM