IDT7MB6091S33K

Factory Authorized Line

INTEGRATED DEVICE TECHNOLOGY

Electronic Component

IDT7MB6091S33K

QIP, QI113,1.7/1.9,100
Call for availability INTEGRATED DEVICE TECHNOLOGY
Mfr Part # IDT7MB6091S33K
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  QIPPACKAGE DESCRIPTION:  QIP, QI113,1.7/1.9,100PACKAGE EQUIVALENCE CODE:  QI113,1.7/1.9,100PACKAGE SHAPE:  RECTANGULARPACKAGE STYLE:  IN-LINEPART PACKAGE CODE:  QIP
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ADDITIONAL FEATURE:  TTL COMPATIBLE INPUTS/OUTPUTS

CLOCK FREQUENCY-MAX (FCLK):  33 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  R-PQIP-P113

JESD-609 CODE:  E0

LENGTH:  73.66 MM

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT7MB6091S33K

MEMORY DENSITY:  1.0486 MBIT

MEMORY IC TYPE:  CACHE SRAM MODULE

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  113

NUMBER OF WORDS:  131.072 K

NUMBER OF WORDS CODE:  128000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  128KX8

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QIP

PACKAGE DESCRIPTION:  QIP, QI113,1.7/1.9,100

PACKAGE EQUIVALENCE CODE:  QI113,1.7/1.9,100

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  QIP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  113

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  7.747 MM

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  1.9 MA

SUPPLY VOLTAGE-MAX (VSUP):  5.25 V

SUPPLY VOLTAGE-MIN (VSUP):  4.75 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  PIN/PEG

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  48.26 MM