ADDITIONAL FEATURE:  MAXIMUM USABLE GATES 28300

COMBINATORIAL DELAY OF A CLB-MAX:  2.2 NS

JESD-30 CODE:  S-PBGA-B256

JESD-609 CODE:  E0

LENGTH:  27 MM

MANUFACTURER:  LATTICE SEMICONDUCTOR CORPORATION

MANUFACTURER PART NUMBER:  OR2C10A4BA256-DB

NUMBER OF CLBS:  256

NUMBER OF EQUIVALENT GATES:  12300

NUMBER OF INPUTS:  221

NUMBER OF LOGIC CELLS:  1024

NUMBER OF OUTPUTS:  221

NUMBER OF TERMINALS:  256

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  256 CLBS, 12300 GATES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA256,20X20,50

PACKAGE EQUIVALENCE CODE:  BGA256,20X20,50

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  256

POWER SUPPLIES:  5 V

PROGRAMMABLE LOGIC TYPE:  FIELD PROGRAMMABLE GATE ARRAY

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.32 MM

SUBCATEGORY:  FIELD PROGRAMMABLE GATE ARRAYS

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  3 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  27 MM