AMPLIFIER TYPE:  OPERATIONAL AMPLIFIER

ARCHITECTURE:  VOLTAGE-FEEDBACK

AVERAGE BIAS CURRENT-MAX (IIB):  80 PA

COMMON-MODE REJECT RATIO-NOM:  91 DB

FREQUENCY COMPENSATION:  YES

INPUT OFFSET VOLTAGE-MAX:  250 ΜV

JESD-30 CODE:  R-PDSO-G5

JESD-609 CODE:  E3

LENGTH:  2.9 MM

LOW-BIAS:  YES

LOW-OFFSET:  YES

MANUFACTURER:  MICROCHIP TECHNOLOGY INC

MANUFACTURER PART NUMBER:  MCP606-I/OT

MICROPOWER:  YES

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  5

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LSSOP

PACKAGE DESCRIPTION:  LSSOP, TSOP5/6,.11,37

PACKAGE EQUIVALENCE CODE:  TSOP5/6,.11,37

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

PART PACKAGE CODE:  SOT-23

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  5

POWER:  NO

POWER SUPPLIES:  3/5 V

PROGRAMMABLE POWER:  NO

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.45 MM

SLEW RATE-NOM:  0.08 V/US

SUBCATEGORY:  OPERATIONAL AMPLIFIER

SUPPLY CURRENT-MAX:  25 ΜA

SUPPLY VOLTAGE LIMIT-MAX:  7 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  950 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

UNITY GAIN BW-NOM:  155 KHZ

VOLTAGE GAIN-MIN:  100000

WIDEBAND:  NO

WIDTH:  1.55 MM