MIC2788-XYMT

Factory Authorized Line

MICROCHIP TECHNOLOGY INC

Electronic Component

MIC2788-XYMT

HVSON, SOLCC8,.08,20
Call for availability MICROCHIP TECHNOLOGY INC
Mfr Part # MIC2788-XYMT
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging MANUFACTURER PACKAGE CODE:  MLFPACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  HVSONPACKAGE DESCRIPTION:  HVSON, SOLCC8,.08,20PACKAGE EQUIVALENCE CODE:  SOLCC8,.08,20PACKAGE SHAPE:  SQUAREPACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILEPART PACKAGE CODE:  DFN
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ADJUSTABLE THRESHOLD:  NO

ANALOG IC - OTHER TYPE:  POWER SUPPLY SUPPORT CIRCUIT

JESD-30 CODE:  S-PDSO-N8

JESD-609 CODE:  E4

LENGTH:  2 MM

MANUFACTURER:  MICROCHIP TECHNOLOGY INC

MANUFACTURER PACKAGE CODE:  MLF

MANUFACTURER PART NUMBER:  MIC2788-XYMT

NUMBER OF CHANNELS:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVSON

PACKAGE DESCRIPTION:  HVSON, SOLCC8,.08,20

PACKAGE EQUIVALENCE CODE:  SOLCC8,.08,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

PART PACKAGE CODE:  DFN

PIN COUNT:  8

POWER SUPPLIES:  3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  600 ΜM

SUBCATEGORY:  POWER MANAGEMENT CIRCUITS

SUPPLY CURRENT-MAX (ISUP):  7.5 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  1.6 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  NICKEL PALLADIUM GOLD

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

WIDTH:  2 MM