CLOCK FREQUENCY-MAX:  19.2 MHZ

JESD-30 CODE:  S-PBGA-B25

JESD-609 CODE:  E1

LENGTH:  1.97 MM

MANUFACTURER:  MICROCHIP TECHNOLOGY INC

MANUFACTURER PART NUMBER:  USB3326C-GL-TR

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF TERMINALS:  25

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  25

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  620 ΜM

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN SILVER COPPER

TERMINAL FORM:  BALL

TERMINAL PITCH:  400 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  1.97 MM

UPS/UCS/PERIPHERAL ICS TYPE:  BUS CONTROLLER, UNIVERSAL SERIAL BUS