ADDITIONAL FEATURE:  METALLURGICALLY BONDED

CASE CONNECTION:  ISOLATED

CONFIGURATION:  SINGLE

DIODE ELEMENT MATERIAL:  SILICON

DIODE TYPE:  ZENER DIODE

DYNAMIC IMPEDANCE-MAX:  19 O

JEDEC-95 CODE:  DO-204AH

JESD-30 CODE:  O-LALF-W2

JESD-609 CODE:  E0

MANUFACTURER:  MICROSEMI CORPORATION

MANUFACTURER PART NUMBER:  1N750A-1TR

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF ELEMENTS:  1

NUMBER OF TERMINALS:  2

OPERATING TEMPERATURE-MAX:  175 °C

PACKAGE BODY MATERIAL:  GLASS

PACKAGE DESCRIPTION:  O-LALF-W2

PACKAGE SHAPE:  ROUND

PACKAGE STYLE:  LONG FORM

PART PACKAGE CODE:  DO-35

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  2

POLARITY:  UNIDIRECTIONAL

POWER DISSIPATION (MAX):  480 MW

QUALIFICATION STATUS:  NOT QUALIFIED

REFERENCE VOLTAGE-NOM:  4.7 V

SUBCATEGORY:  VOLTAGE REFERENCE DIODES

SURFACE MOUNT:  NO

TECHNOLOGY:  ZENER

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  WIRE

TERMINAL POSITION:  AXIAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

VOLTAGE TOL-MAX:  5 %

WORKING TEST CURRENT:  20 MA