BREAKDOWN VOLTAGE-MIN:  25 V

CONFIGURATION:  SINGLE

DIODE CAPACITANCE-MAX:  0.15 PF

DIODE ELEMENT MATERIAL:  SILICON

DIODE FORWARD RESISTANCE-MAX:  2 O

DIODE TYPE:  PIN DIODE

FREQUENCY BAND:  ULTRA HIGH FREQUENCY TO X BAND

JESD-30 CODE:  R-XBCC-N2

JESD-609 CODE:  E4

MANUFACTURER:  MICROSEMI CORPORATION

MANUFACTURER PART NUMBER:  MPL4700-206-HS

NUMBER OF ELEMENTS:  1

NUMBER OF TERMINALS:  2

OPERATING TEMPERATURE-MAX:  150 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE BODY MATERIAL:  UNSPECIFIED

PACKAGE DESCRIPTION:  R-XBCC-N2

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  CHIP CARRIER

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

SURFACE MOUNT:  YES

TECHNOLOGY:  POSITIVE-INTRINSIC-NEGATIVE

TERMINAL FINISH:  GOLD

TERMINAL FORM:  NO LEAD

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED