Mfr Part #
MT8870BC
Qty in Stock
Call for availability
Factory Stock
N/A
Minimum Order
1
Packaging
PACKAGE BODY MATERIAL: CERAMICPACKAGE CODE: DIPPACKAGE DESCRIPTION: DIP, DIP18,.3PACKAGE EQUIVALENCE CODE: DIP18,.3PACKAGE SHAPE: RECTANGULARPACKAGE STYLE: IN-LINEPART PACKAGE CODE: DIP
Availability
- Qty in StockCall for availability
- Min. Order Qty1
Specification
JESD-30 CODE: R-XDIP-T18
MANUFACTURER: MICROSEMI CORPORATION
MANUFACTURER PART NUMBER: MT8870BC
NUMBER OF TERMINALS: 18
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: CERAMIC
PACKAGE CODE: DIP
PACKAGE DESCRIPTION: DIP, DIP18,.3
PACKAGE EQUIVALENCE CODE: DIP18,.3
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: IN-LINE
PART PACKAGE CODE: DIP
PIN COUNT: 18
POWER SUPPLIES: 5 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: TELECOM SIGNALING CIRCUITS
SUPPLY CURRENT-MAX: 9 MA
SUPPLY VOLTAGE-NOM: 5 V
SURFACE MOUNT: NO
TECHNOLOGY: CMOS
TELECOM IC TYPE: DTMF SIGNALING CIRCUIT
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: THROUGH-HOLE
TERMINAL PITCH: 2.54 MM
TERMINAL POSITION: DUAL


