JESD-30 CODE:  S-PBGA-B324

JESD-609 CODE:  E0

MANUFACTURER:  MICROSEMI STORAGE OTN AND NETWORKING SOLUTIONS

MANUFACTURER PART NUMBER:  PM73124-PI

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  324

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA324,22X22,40

PACKAGE EQUIVALENCE CODE:  BGA324,22X22,40

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

POWER SUPPLIES:  2.5,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  ATM/SONET/SDH ICS

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TELECOM IC TYPE:  ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM