JESD-30 CODE:  S-XBGA-B256

MANUFACTURER:  MICROSEMI STORAGE OTN AND NETWORKING SOLUTIONS

MANUFACTURER PART NUMBER:  PM7346-BI

NUMBER OF TERMINALS:  256

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA256,20X20,50

PACKAGE EQUIVALENCE CODE:  BGA256,20X20,50

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

POWER SUPPLIES:  3.3,5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  ATM/SONET/SDH ICS

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM