JESD-30 CODE:  S-PBGA-B272

JESD-609 CODE:  E0

LENGTH:  27 MM

MANUFACTURER:  MICROSEMI STORAGE OTN AND NETWORKING SOLUTIONS

MANUFACTURER PART NUMBER:  PM7367-PI

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  272

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  225

PIN COUNT:  272

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.32 MM

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TELECOM IC TYPE:  FRAMER

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  27 MM