14013B/BCAJC

14013B/BCAJC

DIP, DIP14,.3

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  14013B/BCAJC

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP14,.3

PACKAGE EQUIVALENCE CODE:  DIP14,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-XDIP-T14

JESD-609 CODE:  E0

LOGIC IC TYPE:  D FLIP-FLOP

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  14013B/BCAJC

NUMBER OF FUNCTIONS:  2

NUMBER OF TERMINALS:  14

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP14,.3

PACKAGE EQUIVALENCE CODE:  DIP14,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

POWER SUPPLIES:  5/15 V

PROP. DELAY@NOM-SUP:  450 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SCREENING LEVEL:  38535Q/M;38534H;883B

SUBCATEGORY:  FF/LATCHES

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  MILITARY

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TRIGGER TYPE:  POSITIVE EDGE

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