ADDITIONAL FEATURE:  3 EXECUTION UNITS; 20 MIPS; ON-CHIP EMULATION; PHASE LOCKED LOOP

ADDRESS BUS WIDTH:  16

BARREL SHIFTER:  NO

BIT SIZE:  24

BOUNDARY SCAN:  NO

CLOCK FREQUENCY-MAX:  40 MHZ

EXTERNAL DATA BUS WIDTH:  24

FORMAT:  FIXED POINT

INTEGRATED CACHE:  NO

INTERNAL BUS ARCHITECTURE:  MULTIPLE

JESD-30 CODE:  S-PQFP-G132

JESD-609 CODE:  E0

LENGTH:  24.13 MM

LOW POWER MODE:  NO

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  DSP56002FC40

NUMBER OF DMA CHANNELS:  0

NUMBER OF EXTERNAL INTERRUPTS:  3

NUMBER OF SERIAL I/OS:  2

NUMBER OF TERMINALS:  132

NUMBER OF TIMERS:  1

ON CHIP DATA RAM WIDTH:  24

ON CHIP PROGRAM ROM WIDTH:  0

OPERATING TEMPERATURE-MAX:  105 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BQFP

PACKAGE DESCRIPTION:  BQFP, SPQFP132,1.2SQ

PACKAGE EQUIVALENCE CODE:  SPQFP132,1.2SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, BUMPER

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  512

SEATED HEIGHT-MAX:  4.572 MM

SUBCATEGORY:  DIGITAL SIGNAL PROCESSORS

SUPPLY CURRENT-MAX:  105 MA

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  635 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  24.13 MM

UPS/UCS/PERIPHERAL ICS TYPE:  DIGITAL SIGNAL PROCESSOR, OTHER