ADDRESS BUS WIDTH:  32

BIT SIZE:  32

CLOCK FREQUENCY-MAX:  25 MHZ

DAC CHANNELS:  NO

DMA CHANNELS:  YES

EXTERNAL DATA BUS WIDTH:  32

HAS ADC:  NO

JESD-30 CODE:  S-PBGA-B357

LENGTH:  25 MM

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MC68EN360ZP25C

NUMBER OF I/O LINES:  46

NUMBER OF TERMINALS:  357

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PWM CHANNELS:  NO

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.86 MM

SPEED:  25 MHZ

SUPPLY CURRENT-MAX:  250 MA

SUPPLY VOLTAGE-MAX:  5.25 V

SUPPLY VOLTAGE-MIN:  4.75 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

WIDTH:  25 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER, RISC