MC9S08RE16FJ

Factory Authorized Line

MOTOROLA

Electronic Component

MC9S08RE16FJ

LQFP-32
Call for availability MOTOROLA
Mfr Part # MC9S08RE16FJ
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  QFPPACKAGE DESCRIPTION:  LQFP-32PACKAGE EQUIVALENCE CODE:  QFP32,.35SQ,32PACKAGE SHAPE:  SQUAREPACKAGE STYLE:  FLATPACK
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

BIT SIZE:  8

JESD-30 CODE:  S-PQFP-G32

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MC9S08RE16FJ

NUMBER OF TERMINALS:  32

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  LQFP-32

PACKAGE EQUIVALENCE CODE:  QFP32,.35SQ,32

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

POWER SUPPLIES:  1.8/3.6 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  1024

ROM (WORDS):  16384

ROM PROGRAMMABILITY:  FLASH

SPEED:  16 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY CURRENT-MAX:  4.8 MA

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  QUAD