ACCESS TIME-MAX:  350 NS

I/O TYPE:  COMMON

JESD-30 CODE:  R-XDIP-T24

JESD-609 CODE:  E0

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MCM68766C35

MEMORY DENSITY:  65.536 KBIT

MEMORY WIDTH:  8

NUMBER OF TERMINALS:  24

NUMBER OF WORDS:  8.192 K

NUMBER OF WORDS CODE:  8000

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  8KX8

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP24,.6

PACKAGE EQUIVALENCE CODE:  DIP24,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  OTHER MEMORY ICS

SURFACE MOUNT:  NO

TECHNOLOGY:  MOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL