MRFIC0954R2

Factory Authorized Line

MOTOROLA

Electronic Component

MRFIC0954R2

TSSOP
Call for availability MOTOROLA
Mfr Part # MRFIC0954R2
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  TSSOPPACKAGE DESCRIPTION:  TSSOP,PACKAGE SHAPE:  RECTANGULARPACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

JESD-30 CODE:  R-PDSO-G20

JESD-609 CODE:  E0

LENGTH:  6.5 MM

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MRFIC0954R2

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  20

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-NOM:  2.7 V

SURFACE MOUNT:  YES

TECHNOLOGY:  BICMOS

TELECOM IC TYPE:  RF AND BASEBAND CIRCUIT

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  4.4 MM