XC68HC705P9P

Factory Authorized Line

MOTOROLA

Electronic Component

XC68HC705P9P

DIP, DIP28,.6
Call for availability MOTOROLA
Mfr Part # XC68HC705P9P
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  DIPPACKAGE DESCRIPTION:  DIP, DIP28,.6PACKAGE EQUIVALENCE CODE:  DIP28,.6PACKAGE SHAPE:  RECTANGULARPACKAGE STYLE:  IN-LINE
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

BIT SIZE:  8

CPU FAMILY:  6805

JESD-30 CODE:  R-PDIP-T28

JESD-609 CODE:  E0

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  XC68HC705P9P

NUMBER OF TERMINALS:  28

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP28,.6

PACKAGE EQUIVALENCE CODE:  DIP28,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  128

ROM (WORDS):  2112

ROM PROGRAMMABILITY:  UVPROM

SPEED:  1 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY CURRENT-MAX:  2.3 MA

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL