ADDITIONAL FEATURE:  ALSO REQUIRES 3.3 V I/O SUPPLY

ADDRESS BUS WIDTH:  24

BIT SIZE:  32

CLOCK FREQUENCY-MAX:  20 MHZ

DAC CHANNELS:  NO

DMA CHANNELS:  YES

EXTERNAL DATA BUS WIDTH:  32

HAS ADC:  YES

JESD-30 CODE:  S-PBGA-B208

JESD-609 CODE:  E1

LENGTH:  14 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  LH79524N0F100A1

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF I/O LINES:  108

NUMBER OF TERMINALS:  208

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PWM CHANNELS:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA, BGA208,16X16,32

PACKAGE EQUIVALENCE CODE:  BGA208,16X16,32

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  208

POWER SUPPLIES:  1.8,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

ROM PROGRAMMABILITY:  FLASH

SEATED HEIGHT-MAX:  1.7 MM

SOURCE URL STATUS CHECK DATE:  2013-06-14 00:00:00

SPEED:  76.205 MHZ

SUBCATEGORY:  OTHER MICROPROCESSOR ICS

SUPPLY VOLTAGE-MAX:  1.98 V

SUPPLY VOLTAGE-MIN:  1.62 V

SUPPLY VOLTAGE-NOM:  1.8 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/SILVER/COPPER (SN/AG/CU)

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  14 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER, RISC