CATEGORY:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  I²C, SPI, UART/USART

CORE PROCESSOR:  ARM® CORTEX®-M0

CORE SIZE:  32-BIT

DATA CONVERTERS:  A/D 8X10B

FAMILY:  EMBEDDED - MICROCONTROLLERS

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  LPC1114FHN33/302,5

MANUFACTURER STANDARD LEAD TIME:  12 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  28

OPERATING TEMPERATURE:  -40°C ~ 85°C (TA)

OSCILLATOR TYPE:  INTERNAL

PACKAGE / CASE:  32-VQFN EXPOSED PAD

PACKAGING:  REEL

PERIPHERALS:  BROWN-OUT DETECT/RESET, POR, WDT

PROGRAM MEMORY SIZE:  32KB (32K X 8)

PROGRAM MEMORY TYPE:  FLASH

RAM SIZE:  8K X 8

SERIES:  LPC1100L

SPEED:  50MHZ

STANDARD PACKAGE:  4,000

SUPPLIER DEVICE PACKAGE:  32-HVQFN (7X7)

VOLTAGE - SUPPLY (VCC/VDD):  1.8 V ~ 3.6 V

ALTERNATE PARTS:  LPC1114FHN33/301:5 LPC1114FHN33/303,5