CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  CAN, EBI/EMI, I²C, IRDA, MICROWIRE, SD, SPI, SSI, SSP, UART/USART

CORE PROCESSOR:  ARM® CORTEX®-M3

CORE SIZE:  32-BIT

DATA CONVERTERS:  A/D 4X10B; D/A 1X10B

DETAILED DESCRIPTION:  ARM® CORTEX®-M3 LPC18XX MICROCONTROLLER IC 32-BIT 180MHZ 512KB (512K X 8) FLASH

EEPROM SIZE:  16K X 8

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  LPC1812JET100E

MANUFACTURER STANDARD LEAD TIME:  12 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  49

OPERATING TEMPERATURE:  -40°C ~ 105°C (TA)

OSCILLATOR TYPE:  INTERNAL

PACKAGE / CASE:  100-TFBGA

PACKAGING:  TRAY

PERIPHERALS:  BROWN-OUT DETECT/RESET, DMA, I²S, POR, WDT

PROGRAM MEMORY SIZE:  512KB (512K X 8)

PROGRAM MEMORY TYPE:  FLASH

RAM SIZE:  104K X 8

SERIES:  LPC18XX

SPEED:  180MHZ

STANDARD PACKAGE:  260

VOLTAGE - SUPPLY (VCC/VDD):  2.2 V ~ 3.6 V