ADDITIONAL FEATURE:  ALSO REQUIRES 3.3 V SUPPLY

ADDRESS BUS WIDTH:  24

BIT SIZE:  32

CPU FAMILY:  ARM7

CLOCK FREQUENCY-MAX:  50 MHZ

DAC CHANNELS:  NO

DMA CHANNELS:  NO

EXTERNAL DATA BUS WIDTH:  32

HAS ADC:  YES

JESD-30 CODE:  S-PBGA-B144

JESD-609 CODE:  E1

LENGTH:  12 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PACKAGE CODE:  SOT-569-1

MANUFACTURER PART NUMBER:  LPC2220FET144/G

MOISTURE SENSITIVITY LEVEL:  2

NUMBER OF I/O LINES:  76

NUMBER OF TERMINALS:  144

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PWM CHANNELS:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA, BGA144,13X13,32

PACKAGE EQUIVALENCE CODE:  BGA144,13X13,32

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  144

POWER SUPPLIES:  1.8,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  65536

ROM (WORDS):  0

SEATED HEIGHT-MAX:  1.2 MM

SPEED:  75 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY CURRENT-MAX:  70 MA

SUPPLY VOLTAGE-MAX:  1.95 V

SUPPLY VOLTAGE-MIN:  1.65 V

SUPPLY VOLTAGE-NOM:  1.8 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/SILVER/COPPER (SN/AG/CU)

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  12 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER, RISC