CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  CAN, EBI/EMI, LIN, SPI, UART/USART

CORE PROCESSOR:  ARM9®

CORE SIZE:  16/32-BIT

DATA CONVERTERS:  A/D 16X10B

EXPANDED DESCRIPTION:  ARM9® LPC2900 MICROCONTROLLER IC 16/32-BIT 80MHZ 512KB (512K X 8) FLASH 144-LQFP (20X20)

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  LPC2917FBD144/01/,

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  108

OPERATING TEMPERATURE:  -40°C ~ 85°C (TA)

OSCILLATOR TYPE:  INTERNAL

PACKAGE / CASE:  144-LQFP

PACKAGING:  TRAY

PERIPHERALS:  POR, PWM, WDT

PROGRAM MEMORY SIZE:  512KB (512K X 8)

PROGRAM MEMORY TYPE:  FLASH

RAM SIZE:  80K X 8

SERIES:  LPC2900

SPEED:  80MHZ

STANDARD PACKAGE:  60

SUPPLIER DEVICE PACKAGE:  144-LQFP (20X20)

VOLTAGE - SUPPLY (VCC/VDD):  1.71 V ~ 3.6 V