CATEGORY:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB

CORE PROCESSOR:  ARM9®

CORE SIZE:  16/32-BIT

DATA CONVERTERS:  A/D 24X10B

EEPROM SIZE:  16K X 8

FAMILY:  EMBEDDED - MICROCONTROLLERS

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  LPC2929FBD144,551

MANUFACTURER STANDARD LEAD TIME:  12 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  2 (1 YEAR)

NUMBER OF I/O:  104

OPERATING TEMPERATURE:  -40°C ~ 85°C (TA)

OSCILLATOR TYPE:  INTERNAL

PACKAGE / CASE:  144-LQFP

PACKAGING:  TRAY

PERIPHERALS:  DMA, POR, PWM, WDT

PROGRAM MEMORY SIZE:  768KB (768K X 8)

PROGRAM MEMORY TYPE:  FLASH

RAM SIZE:  56K X 8

SERIES:  LPC2900

SPEED:  125MHZ

STANDARD PACKAGE:  60

SUPPLIER DEVICE PACKAGE:  144-LQFP (20X20)

VOLTAGE - SUPPLY (VCC/VDD):  1.71 V ~ 3.6 V