CATEGORY:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  EBI/EMI, I²C, MEMORY CARD, SPI, UART/USART, USB OTG

CORE PROCESSOR:  ARM9®

CORE SIZE:  16/32-BIT

DATA CONVERTERS:  A/D 3X10B

FAMILY:  EMBEDDED - MICROCONTROLLERS

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  LPC3180FEL320/01,5

MANUFACTURER STANDARD LEAD TIME:  39 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  55

OPERATING TEMPERATURE:  -40°C ~ 85°C (TA)

OSCILLATOR TYPE:  EXTERNAL

PACKAGE / CASE:  320-LFBGA

PACKAGING:  TRAY

PERIPHERALS:  DMA, PWM, WDT

PROGRAM MEMORY TYPE:  ROMLESS

RAM SIZE:  64K X 8

SERIES:  LPC3100

SPEED:  208MHZ

STANDARD PACKAGE:  160

SUPPLIER DEVICE PACKAGE:  320-LFBGA (13X13)

VOLTAGE - SUPPLY (VCC/VDD):  1.1 V ~ 3.3 V