CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  SCI, SPI

CORE PROCESSOR:  HC11

CORE SIZE:  8-BIT

DATA CONVERTERS:  A/D 8X8B

EEPROM SIZE:  512 X 8

LEAD FREE STATUS / ROHS STATUS:  CONTAINS LEAD / ROHS NON-COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  MC68HC11F1CFN3

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  30

OPERATING TEMPERATURE:  -40°C ~ 85°C (TA)

OSCILLATOR TYPE:  INTERNAL

PACKAGE / CASE:  68-LCC (J-LEAD)

PACKAGING:  TUBE

PERIPHERALS:  POR, WDT

PROGRAM MEMORY TYPE:  ROMLESS

RAM SIZE:  1K X 8

SERIES:  HC11

SPEED:  3MHZ

STANDARD PACKAGE:  18

SUPPLIER DEVICE PACKAGE:  68-PLCC (25X25)

VOLTAGE - SUPPLY (VCC/VDD):  4.75 V ~ 5.25 V