BASE PART NUMBER:  MC9S12DG128

CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  CANBUS, I²C, SCI, SPI

CORE PROCESSOR:  HCS12

CORE SIZE:  16-BIT

DATA CONVERTERS:  A/D 16X10B

DETAILED DESCRIPTION:  HCS12 HCS12 MICROCONTROLLER IC 16-BIT 25MHZ 128KB (128K X 8) FLASH 112-LQFP (20X20)

EEPROM SIZE:  2K X 8

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  MC9S12DG128CPVE

MANUFACTURER STANDARD LEAD TIME:  15 WEEKS

NUMBER OF I/O:  91

OPERATING TEMPERATURE:  -40°C ~ 85°C (TA)

OSCILLATOR TYPE:  INTERNAL

PACKAGE / CASE:  112-LQFP

PACKAGING:  TRAY

PERIPHERALS:  PWM, WDT

PROGRAM MEMORY SIZE:  128KB (128K X 8)

PROGRAM MEMORY TYPE:  FLASH

RAM SIZE:  8K X 8

SERIES:  HCS12

SPEED:  25MHZ

SUPPLIER DEVICE PACKAGE:  112-LQFP (20X20)

VOLTAGE - SUPPLY (VCC/VDD):  2.35 V ~ 5.25 V

ALTERNATE PARTS:  MC9S12DG128CPVER