CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  CAN, I²C, SCI, SPI

CORE PROCESSOR:  HCS12

CORE SIZE:  16-BIT

DATA CONVERTERS:  A/D 16X10B

EEPROM SIZE:  4K X 8

LEAD FREE STATUS / ROHS STATUS:  CONTAINS LEAD / ROHS NON-COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  MC9S12DP256BMPV

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  91

OPERATING TEMPERATURE:  -40°C ~ 125°C (TA)

OSCILLATOR TYPE:  INTERNAL

PACKAGE / CASE:  112-LQFP

PACKAGING:  TRAY

PERIPHERALS:  PWM, WDT

PROGRAM MEMORY SIZE:  256KB (256K X 8)

PROGRAM MEMORY TYPE:  FLASH

RAM SIZE:  12K X 8

SERIES:  HCS12

SPEED:  25MHZ

STANDARD PACKAGE:  300

SUPPLIER DEVICE PACKAGE:  112-LQFP (20X20)

VOLTAGE - SUPPLY (VCC/VDD):  2.35 V ~ 5.25 V

ALTERNATE PARTS:  MC9S12DP512MPVE