CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  EBI/EMI, SCI, SPI

CORE PROCESSOR:  HCS12

CORE SIZE:  16-BIT

DATA CONVERTERS:  A/D 8X10B

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  MC9S12GC32MPBE

MANUFACTURER STANDARD LEAD TIME:  6 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  35

OPERATING TEMPERATURE:  -40°C ~ 125°C (TA)

OSCILLATOR TYPE:  INTERNAL

PACKAGE / CASE:  52-LQFP

PACKAGING:  TRAY

PERIPHERALS:  POR, PWM, WDT

PROGRAM MEMORY SIZE:  32KB (32K X 8)

PROGRAM MEMORY TYPE:  FLASH

RAM SIZE:  2K X 8

SERIES:  HCS12

SPEED:  25MHZ

STANDARD PACKAGE:  160

SUPPLIER DEVICE PACKAGE:  52-LQFP (10X10)

VOLTAGE - SUPPLY (VCC/VDD):  2.35 V ~ 5.5 V